Mini/Micro LED智能去除设备——三合一返修机Laser Trimming

Mini/Micro LED Laser repair cleaning equipment Laser Trimming

海目星激光科技集团股份有限公司

Hymson Laser Technology Group Co., Ltd.

本机型采用定制高品质极细光斑的激光系统，主要针对新型显示行业Mini/Micro LED与半导体等精密制造行业，实现各类型Wafer、微型电路、封装前后芯片之加工工艺，其1~10微米的自由光班大小调整对其他产品进行各种高自由度的极细致微加工。

例如：对产品进行孔径5-10微米打孔，对产品打码尺寸小至0.1*0.1mm，表面材料的剥离工艺等等微加工皆能完成。

搭配飞秒级激光器能输出极高峰值功率，容易进行材料解离，其极短的脉宽亦可实现作用时间远小于电子晶格散射的时间激光脉冲作用完成时能量来不及传递给晶格，使热影响降至最低，应用范围相当广泛。

本设备通过视觉系统可实时监控产品加工状态与加工效果，有效兼容不同种类、尺寸的产品。通过影像视觉定位系统，结合直线电机平台，可实现高精度定位；提供人性化的人机接口，简单、易操作。

振镜加工速度0～2500mm/s可调，平台移动速度0～500mm/s可调。本设备具有响应速度快、生产效率高、加工定位准等特点，具有高效益、低成本优势，有助于院校、企业等使用者大幅提高行业竞争力。

Our equipment was designed for the new display industry Mini/Micro LED and semiconductor and other precision manufacturing industries. The equipment adopts customized high quality laser system with extremely fine light spots, so achieve the processing of various types of Wafer, microcircuit, chip before and after packaging. With 1-10 micron free and adjusted light shift size, the equipment can realize and carry out high degree of freedom of fine and micro processing of products.

For example, can complete the product aperture 5~10 micron drilling, the product engraving size as small as 0.1*0.1mm, surface material stripping process and so on.

With a femtosecond laser, it can output extremely high peak power, easy to dissociate the material from its very short pulse width. The action time can be far less than the time of electron lattice scattering. When the laser pulse action is completed, the energy cannot be transferred to the lattice, so that the thermal effect is minimized, The application range is quite wide.

The equipment can monitor the processing status and effect of products in real time through the visual system, effectively compatible with different types and sizes of products through the image visual positioning system, combined with the linear motor platform, can achieve high precision positioning to provide human man-machine interface, the application software is more simple and easy to operate.

The processing speed of the galvanometer can be freely adjusted in the range of 0~2500mm/s, and the platform moving speed can be freely adjusted in the range of 0~500mm/s. The equipment has the characteristics of fast response speed, high production efficiency, high processing positioning, and has the advantages of high efficiency and low cost, which helps the users such as colleges and enterprises to greatly improve the competitiveness of the industry.

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