Mini/Micro LED激光巨量焊接设备   Laser Mass Welding

海目星激光科技集团股份有限公司

Hymson Laser Technology Group Co., Ltd.

Micro LED作为下一代显示技术，因生产成本居高不下，导致无法量产，该项研制的Micro LED激光巨量焊接装备，其目标是解决Micro LED及巨量芯片与基板的焊接，Micro LED封装制程中，巨量焊接设备在显示屏商业化中的研发进程备受瞩目，在重要市场化潜力中引起了国内外公司的重点关注。项目研制的Micro LED激光高速巨量焊接装备，其核心是满足巨量芯片与基板的焊接，技术难度高、设计复杂，具备高速高精度的微米级运动控制、光学识别与计算等技术、全闭环精准温控系统，以及焊接过程中各种工艺细节参数高自由度的精准控制，实现了Micro LED巨量焊接可量产之技术。

As a next-generation display technology, Micro LED cannot be mass-produced due to high production costs. The Micro LED laser mass welding equipment is designed to solve the welding problem between Micro LED chip and substrate. In the process of Micro LED packaging, the research and development process of mass welding equipment in the commercialization of display screen has attracted much attention, which has attracted the attention of domestic and foreign companies in the important market potential.

The core of the Micro LED laser high-speed and massive welding equipment developed by the project is to meet the welding requirements of mass chips and substrates. With high technical difficulty and complex design, it has high-speed and high-precision micron motion control, optical recognition and calculation technology, full-closed-loop precise temperature control system, and high degree of freedom precise control of various process details parameters in the welding process, realizing the mass production technology of Micro LED mass welding.

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